1. Advanced wirebond interconnection technology

کتابخانه: Central Library and Documents Center of Mazandaran University (Mazandaran)

موضوع : Wire bonding (Electronic packaging) ; Production control ; Electronic packaging ; Reliability ;

2. Wire bonding in microelectronics

پدیدآورنده :

موضوع : Wire bonding (Electronic packaging) -- Production control,Electronic packaging -- Reliability,Electronic packaging -- Defects,Semiconductors -- Failures

۲ نسخه از این کتاب در ۲ کتابخانه موجود است.

3. Wire bonding in microelectronics

پدیدآورنده :

کتابخانه: University of Tabriz Library, Documentation and Publication Center (East Azarbaijan)

موضوع : Wire bonding (Electronic packaging), Production control,Electronic packaging, Reliability,Electronic packaging, Defects

رده :
TK7836
.
H366
2010